Electron Microscopy
Integrated plasma cleaning and secure TEM holder storage in a single compact system
Effective hydrocarbon contamination removal to support high-resolution TEM imaging
Protects sensitive TEM holders and helps extend operational lifetime
Maintains holder cleanliness between experiments, reducing handling-related contamination
Stable, controlled plasma process for repeatable cleaning performance
User-friendly operation suitable for routine EM laboratory workflows
Improves imaging reliability and experimental reproducibility in TEM analysis
Ideal for university, research, and industrial electron microscopy facilities
· Stable, uniform glow discharge for consistent surface treatment
· Dedicated TEM grid sample stage for precise handling
· Simultaneous cleaning of up to 12 copper grids, improving efficiency
· Gentle gas inlet and exhaust to prevent sample displacement
· Integrated safety interlock with automatic power cut-off when the chamber is opened
Magnetron sputter coating technology for rapid, uniform conductive thin-film deposition
Optimised for SEM sample preparation, reducing charging and improving image clarity
Multi-angle, height-adjustable sample stage for comprehensive coating coverage
Stable and repeatable deposition performance for routine and research workflows
Intuitive user interface with straightforward parameter control and monitoring
Compatible with a wide range of coating materials for diverse application needs
Low maintenance, laboratory-ready design ensuring reliable long-term operation
Suitable for materials science, life science, semiconductor, and industrial analysis
The Gas Injection System (GIS) is a fundamental component of FIB-SEM instrumentation, providing two key functions: material deposition and assisted etching.
The Dalex-100 GIS supplies precursor gases including Pt, W, and C for protective deposition during cross-sectioning and TEM sample preparation, as well as Pt, W, and SiO₂ for circuit repair applications. It also enables XeF₂-assisted silicon etching to enhance cutting rates.
In addition, the system supports a range of specialised precursor gases for targeted milling and gas-assisted dry etching of specific materials.
